Head office

In 2026, Kenmec Mechanical Engineering (6125-TW) is pursuing a core strategy centered on "Technology Integration, Practical Application, and Value Expansion." In addition to securing new public infrastructure contracts in its automation business, the company expects to recognize revenue from the completion of the baggage handling system at Terminal 3 of Taiwan Taoyuan International Airport. Meanwhile, the NT$700 million capital raising plan of its subsidiary, TAISIC Materials (6930-TW), was declared effective by Taiwan's Financial Supervisory Commission (FSC) today (22nd).

Following the successful completion of a NT$500 million capital increase in 2025, TAISIC Materials plans to issue an additional 20 million new shares in 2026, increasing its paid-in capital from NT$500 million to NT$700 million. The company tentatively plans to issue the shares at NT$35 per share, raising a total of NT$700 million from the market. The capital increase was declared effective by the FSC today.

TAISIC Materials is currently the only manufacturer in Taiwan capable of supplying both device-grade N-type (conductive) and SI-type (semi-insulating) silicon carbide (SiC) substrates. In terms of product development, its N-type substrates have advanced to the mainstream 8-inch specification, while its SI-type substrates maintain a stable supply.

TAISIC Materials is currently owned by Tainergy Tech (4934-TW), which holds a 42.28% stake, Kenmec Mechanical Engineering, which holds 8.55%, and Foxconn Group (2317-TW), which holds 7.1%.

Source:鉅亨網

https://gfe-desktop.cnyes.com/news/id/6467126