22
2026/09

TAISIC Materials Cordially Invites You to ICSCRM 2026 — Exploring the Future of SiC Materials Together

TAISIC Materials Corp. is pleased to announce its participation in the International Conference on Silicon Carbide and Related Materials (ICSCRM 2026). We cordially invite customers, industry partners, and professionals from around the world to visit our booth and connect with our team.

At this year's exhibition, TAISIC will showcase its diverse portfolio of silicon carbide (SiC) materials, including our established N-type conductive and semi-insulating SiC products, alongside our latest developments in 12-inch SiC materials and P-type SiC products. These innovations reflect our continued commitment to large-diameter crystal growth, advanced material technologies, and new product development.

As SiC applications continue to expand across power electronics, RF communications, AI data centers, and advanced packaging, TAISIC remains dedicated to delivering high-quality and competitive SiC material solutions through our proprietary crystal growth technology and diversified product portfolio.

We look forward to engaging with customers and partners from around the world at ICSCRM 2026, exchanging insights, and exploring new opportunities for innovation and collaboration.

We warmly welcome you to visit our booth and look forward to seeing you in Yokohama!

Exhibition Information

Item

Details

Event

ICSCRM 2026

Date

September 27 – October 2, 2026

Venue

PACIFICO YOKOHAMA North, Japan

TAISIC Booth

Exhibition-A (1F), E-3