Kenmec and Tainergy Year-End Banquet: TAISIC Materials Expects Revenue to Double This Year as SiC Shipments Ramp Up
TAISIC Materials Expects Revenue to Multiply in 2026, Driven by Growing Demand for 8-Inch N-Type and Semi-Insulating SiC Substrates
Kenmec Mechanical Engineering (6125-TW) held its annual year-end banquet today. Its subsidiary, TAISIC Materials (6930-TW), is actively expanding its presence in the third-generation semiconductor silicon carbide (SiC) sector.
Looking ahead to 2026, TAISIC Materials General Manager Ming-Hsun Hsieh stated that the company successfully passed factory audits conducted by four customers in Taiwan and Japan in 2025. With increasing demand for 8-inch N-type conductive SiC substrates and encouraging progress in semi-insulating (SI) products, the company expects its annual revenue to grow severalfold.
TAISIC Materials completed a NT$200 million capital increase last year, raising its paid-in capital from NT$500 million to NT$700 million. The company is currently the only manufacturer in Taiwan capable of supplying both device-grade N-type (conductive) and SI-type (semi-insulating) SiC substrates.
Its N-type substrates have advanced to the mainstream 8-inch specification, while its SI-type substrates are steadily supplied in 4-inch and 6-inch formats.
Hsieh explained that SiC substrate manufacturing involves extremely high technical barriers in crystal growth. Following years of research and development and continuous process optimization, TAISIC Materials passed factory audits conducted by four semiconductor customers last year and entered the stable supply stage.
As customers progressively complete their product qualification processes, shipment volumes are expected to increase substantially this year, driving significant revenue expansion.
Furthermore, with support from the Ministry of Economic Affairs' technology development programs, TAISIC Materials completed the development of 8-inch semi-insulating SiC substrates in 2025.
In 2026, the company plans to take on the more challenging development of 12-inch semi-insulating SiC substrates, laying the foundation for domestic production of ultra-large-diameter SiC products for future applications and ensuring Taiwan's continued participation in the global competition for critical semiconductor materials.
Hsieh noted that 12-inch semi-insulating substrates are primarily intended for specialized applications.
As AI chips face increasing thermal management challenges, advanced packaging technologies are generating new demand for heat dissipation and interposer applications.
Cooling solutions are evolving from air cooling to liquid cooling technologies. SiC, as an emerging thermal management material, combined with microchannel liquid cooling plates (MLCP), is regarded as a promising solution for advanced chip cooling.
Regarding augmented reality (AR) glasses, Hsieh expressed optimism about SiC optical waveguide technology, which offers a high refractive index and a wide field of view (FOV) of approximately 70 degrees, along with high brightness, lightweight design, thin form factors, and durability.
Other potential applications include drones and electric vertical take-off and landing (eVTOL) aircraft.
TAISIC Materials reported revenue of NT$33.88 million last year, representing year-on-year growth of 6.73%.
Looking ahead to 2026, the company expects its revenue to increase severalfold.
Source: Anue (鉅亨網)
Original Article: https://news.cnyes.com/news/print/6321032?exp=a